Grounding and bonding is integral to the reliable performance of both electrical and telecommunications systems. This Standard provides basic principles, components, and design of telecommunications bonding and grounding that shall be followed to ensure that the telecommunication bonding and grounding systems within a building will have one electrical potential. This Standard describes a common bonding infrastructure for telecommunications equipment providing shared services and the connection of individual tenant bonding infrastructures to the common bonding infrastructure when present or to the equipment power ground when a common bonding infrastructure is not present.
The inside bend radius of telecommunications bonding conductors terminated at the primary bonding busbar PBB or secondary bonding busbar SBB shall have an inside bend radius of mm 8 in. At other locations, bends in the bonding conductors should be limited to the greatest practical inside bend radius with a minimum bend radius of 10 times the bonding conductor diameter recommended. The grounding requirements for shielded cabling systems are identical to those specified for unshielded cabling systems with the exception of the following additional step:.
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